Posted

30+ days ago

Location

Palo Alto, CA

Description

Process Development Engineer


General information


City: Palo Alto


State/Province: California


Country: United States


Department: Research & Development


Date: Wednesday, January 27, 2021


Working time: Full-time


Ref#: 20010310


Job Level: Individual Contributor


Job Type: Experienced


Job Field: Research & Development


Description & Requirements


Process Development Engineer


Bright Ceramic Technologies is an advanced materials company that was recently founded to commercialize its unique technology platform. BCT is seeking a motivated and experienced process development engineer with a semiconductor packaging and assembly background to execute in an advanced R&D and production environment.


Bright’s materials platform is still in its development phase, and targets highly specialized applications. Therefore, it is expected that novel packaging designs and approaches may be needed, and that in the near term the new team member will be focused on low-volume, proof-of-concept design and implementation. He or she will work with scientists, engineers and technicians in a dynamic environment, and should be comfortable with hands-on work as part of a small team. Custom tooling may be required, and the successful candidate should be comfortable either designing such systems or specifying design requirements to other engineers.


Responsibilities of the role include:


+ Lead technology development

+ Develop and implement new backend processing, packaging, and chip-interface PCB design

+ Project lead for yield improvement, process optimization, integration, and process control initiatives

+ Expert user and maintenance for critical equipment in the process line


The successful candidate will have a combination of the following qualifications:


+ US Citizenship

+ Over 5 years of experience in production and R&D environment

+ Extensive experience in semiconductor assembly processes -- die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation, anodic bonding and back-end processes

+ Background in process development of new tools

+ Excellent verbal and written communication abilities


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