Seeking an experienced Process Engineer to develop, implement, and sustain electroplating processes for microelectronics manufacturing, specifically focusing on 3D wafer-scale fabrication technologies. The role involves process development, transfer to operations, data analytics, and continuous improvement of process capability (CpK). Candidates should have at least 3-5 years of relevant microfabrication electroplating experience, with a strong understanding of data analytics, statistics, and DOE. Preferred qualifications include a PhD, semiconductor fabrication experience, wafer characterization knowledge, and security clearance eligibility. The position is onsite in Cedar Rapids, IA, offering competitive benefits and salary ranging from $86,800 to $165,200. U.S. citizenship is required, and the role emphasizes collaboration, innovation, and contributing to advanced aerospace microelectronics development.