["PCB Layout Engineer","PCB Layout Engineer"]

PCB Layout Engineer

Fremont CA (Onsite)

Key Responsibilities

• Own the end-to-end PCB layout process for complex, high-density server and compute boards.
• Develop high-speed PCB layouts supporting DDR4/DDR5, LPDDR5, HBM, PCIe Gen5/Gen6, USB 3.2+, and other high-speed interfaces.
• Apply controlled impedance routing, length matching, differential pair routing, and crosstalk mitigation techniques.
• Design multilayer HDI PCBs utilizing blind, buried, and microvia technologies.
• Collaborate with electrical engineers to review schematics, optimize component placement, power distribution, and signal integrity.
• Work closely with mechanical engineers to resolve board outline, connector placement, thermal, and enclosure constraints.
• Create and maintain PCB stack-ups, design rules, constraint files, and footprint libraries using Cadence Allegro Constraint Manager (CES).
• Conduct Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews with fabrication and manufacturing partners.
• Support prototype bring-up by providing layout documentation, net tracing, ECO implementation, and design revision analysis.
• Ensure PCB layouts meet performance, quality, manufacturability, and reliability requirements.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field.
• 10–14 years of PCB layout and CAD experience.
• Strong expertise with Cadence Allegro PCB Designer 23.1 or later.
• Extensive experience designing high-speed, high-density PCBs for server or compute hardware.
• Hands-on experience with HDI technology, including blind, buried, and microvias.
• Strong understanding of high-speed interfaces including DDR4/DDR5, LPDDR5, HBM, PCIe Gen5/Gen6, USB 3.2+, Ethernet, and other high-speed protocols.
• Experience with Constraint Editor (CES) and constraint-driven PCB design methodologies.
• Strong knowledge of PCB stack-up development, power integrity (PI), signal integrity (SI), controlled impedance, and differential routing.
• Experience with DFM, DFA, and DFT principles for high-volume manufacturing.
• Excellent communication, collaboration, and problem-solving skills.

Preferred Qualifications

• Experience designing Intel-based server motherboards or complex SoC/FPGA platforms.
• Experience working on AI, data center, networking, telecom, or high-performance computing hardware.
• Familiarity with SI/PI analysis tools and PCB fabrication processes.
• Experience supporting prototype builds through production release.