7096 - Product Development Engineer

ORYX

Lehi, Utah

JOB DETAILS
SKILLS
Analysis Skills, CMOS, Corrective Action, Cross-Functional, Data Analysis, Electrical Components, Electrical Engineering, Electricity, Failure Analysis, IDMS (Integrated Database Management System), Manufacturing, Material Science, Metrics, Performance Engineering, Performance Tuning/Optimization, Physics, Problem Solving Skills, Process Development, Process Engineering, Process Flow, Process Improvement, Product Development, Product Engineering, Production Control, Production Specifications, Productivity Management, Reliability Engineering, Root Cause Analysis, Semiconductor Manufacturing, Semiconductors, Simulation, System Integration (SI), Test Data, United States Department of Energy (DOE)
LOCATION
Lehi, Utah
POSTED
4 days ago

Product Development Engineer (28nm CMOS)


Confidential – Leading Semiconductor Manufacturer


Why This Role

This is a rare opportunity to work at the core of 28nm CMOS technology development, where device physics meets real-world production. You’ll take ownership of process integration, drive yield improvements, and help transition advanced nodes into high-volume manufacturing.

If you enjoy solving complex problems at the transistor and process level—and want your work to directly impact production—this role delivers.


What You’ll Do


Process Integration & Device Optimization

  • Develop and refine 28nm CMOS process flows across FEOL/BEOL
  • Optimize transistor performance, variability, and reliability
  • Work closely with device, design, and fab teams to align performance targets


Yield & Performance Engineering

  • Analyze electrical test data, inline metrics, and defectivity trends
  • Drive yield improvement through root cause analysis and corrective actions
  • Correlate parametric data to process variations and device behavior


Technology Transfer & Manufacturing Ramp

  • Support transition from development to high-volume manufacturing (HVM)
  • Define process windows, control plans, and production specs
  • Partner with manufacturing teams to ensure stable, repeatable output


Cross-Functional Collaboration

  • Interface with design, modeling, and reliability teams
  • Contribute to DTCO/STCO efforts for performance and scaling
  • Support failure analysis and long-term reliability improvements


What You Bring

  • BS/MS/PhD in Electrical Engineering, Materials Science, Physics, or related field
  • ~5–12 years of experience in semiconductor process development or integration
  • Strong background in:
  • CMOS technology (28nm preferred)
  • Process integration (FEOL, HKMG, silicidation, or BEOL)
  • Device physics and electrical characterization
  • Experience with:
  • Yield analysis, DOE, SPC, and failure analysis
  • TCAD or electrical simulation tools (a plus)
  • Ability to work cross-functionally in a fast-paced fab environment


What Makes This Role Different

  • End-to-end ownership — from process development to production ramp
  • High visibility — direct impact on yield, performance, and business outcomes
  • Advanced node exposure — meaningful work at 28nm and beyond
  • Technical depth — real device-level problem solving, not just incremental optimization


Ideal Backgrounds

  • Process Integration Engineer (CMOS / Logic)
  • Device Engineer with strong fab interaction
  • Yield / Product Engineer with deep process understanding
  • Engineers from leading IDMs or foundries working on sub-40nm nodes 



About the Company

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ORYX