Responsible for defining, developing, and delivering advanced optical packaging architectures for next-generation optical engines, silicon photonics products, and co-packaged optics platforms. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement. The ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This role also requires strong cross-functional execution to translate advanced packaging concepts into scalable, manufacturable product solutions. Define package architecture and technology direction for advanced optical and optoelectronic products, including optical engines, silicon photonics assemblies, and co-packaged optics platforms. Lead design and optimization substrate design, including stack-up definition, routing topology, via strategy, escape planning, impedance control, and manufacturability tradeoffs. Drive optical, electrical, mechanical, and thermal co-design across package development to achieve robust product performance and integration. Lead development and integration of hybrid bonding solutions for fine-pitch die integration and advanced package assembly. Establish design methodology for warpage analysis, thermo-mechanical modeling, material interaction assessment, and package robustness through assembly and reliability conditions. Own signal integrity strategy for high-speed package and substrate interconnects, including channel loss, discontinuities, crosstalk, impedance control, and interface optimization. Define package design rules, interconnect architecture, and integration guidelines that scale across multiple product generations. Partner closely with PIC, IC, systems, packaging, test, reliability, operations, and manufacturing teams to close design tradeoffs and drive execution. Work directly with OSATs, foundries, substrate suppliers, and ecosystem partners to enable scalable and production-worthy packaging solutions. Lead root-cause analysis and technical resolution of package performance, yield, assembly, and reliability issues. * Mentor engineers across disciplines and contribute to package design methodology, technical reviews, and engineering best practices.