Job Title: Advanced Package Design Engineer
Office Location: San Jose, CA
Work Model: Onsite
About SK hynix America
At SK hynix America, we are at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in todays most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We are looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you will be part of a team that is pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We are not just adapting to technological change - we are driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of whats possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
Job Summary:
We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. Youll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions.
Responsibilities:
• Design silicon and organic interposers for advanced packaging solutions • Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts • Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design • Create and maintain layout design rules, stack-ups, and layout guidelines • Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
Qualifications:
• Bachelor's or Master's degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field • 3+ years of experience in semiconductor package design or layout • Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition • Understanding of high-speed signal routing, power distribution networks (PDN) • Familiarity with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies • Effective communication skills and ability to work in a fast-paced, cross-functional environment
Preferred Qualifications:
• Currently pursuing a PhD's degree in Electrical Engineering or a related field • 5+ years of experience in advanced packaging layout design • Experience with SI/PI simulation tools (Ansys, HFSS, ADS) • Proven understanding of high-speed signal routing, power distribution networks (PDN) • Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
Benefits:
• Top Tier health insurance at no employee cost • Paid day offs: PTO + Company Holidays + Happy Fridays • Paid Parental Leave Program • 401k Matching • Educational reimbursement up to $10,000 per year • Donation Matching and volunteering opportunities • Corporate discount programs • Free Breakfast/Lunch/Dinner provided to employees
Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.