Advanced Packaging & Layout Design Engineer

SkyWater Technology Foundry

  • Bloomington, MN
  • 27 days ago
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    Skills

    • 3D Graphics Softwareunmatched
    • AutoCADunmatched
    • Cadenceunmatched
    • Communication Skillsunmatched
    • Cost Analysisunmatched
    • Cross-Functionalunmatched
    • Customer Support/Serviceunmatched
    • Electrical Engineeringunmatched
    • Hardware Administrationunmatched
    • High Reliabilityunmatched
    • Industry/Trade Analysisunmatched
    • Integrated Circuit Packagingunmatched
    • Manufacturing Assemblyunmatched
    • Manufacturing Costunmatched
    • Material Scienceunmatched
    • Package Layout Designunmatched
    • Physicsunmatched
    • Presentation/Verbal Skillsunmatched
    • Problem Solving Skillsunmatched
    • Process Developmentunmatched
    • Product Supportunmatched
    • Production Scheduleunmatched
    • Risk Analysisunmatched
    • Security Clearanceunmatched
    • Signal Integrityunmatched
    • Technical/Engineering Designunmatched
    • Testingunmatched
    • United States Citizenunmatched
    • Wafer Assemblyunmatched
    • Writing Skillsunmatched

    Description

    Position Summary:SkyWater Technology is looking for a hardworking, and passionate experienced Advanced Packaging and Layout Designer for our Florida Advanced Packaging site. In this role, you will lead design activities to support client products, support hardware such as custom die / bridges and test vehicles to establish Process Design Kits (PDK). Co-design methodology and design should be utilized to create an optimized final package structure based upon customer needs that include the full stack from die, interposer (organic / silicon), and laminate along with reliability support hardware. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

    Major Area of Accountability

    Design and layout of advanced 2.5D/3D packages based on FOWLP, interposer, and other advanced heterogeneous integration technologiesDevelopment and preparation of detailed drawings for customers, such as package outline drawings, and detailed drawings for IC packaging designsTrain customers on use of PDKs for their own designs and provide customer support, including trade-space analysis, schedule, cost, risk analysis.Ensure robust manufacturable designs, while minimizing manufacturing costs and schedule, while ensuring high reliability and quality

    Required Qualifications:

    Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. A commensurate combination of degree and experience will be considered.Experience and Skills:12+ years of advanced package design and layoutProject Management skills and/or defined training a plus.Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.Knowledge of wafer level package assembly and manufacturing processesAdvanced packaging Signal and Power Integrity design and analysisSoftware experience in Cadence APD and/or Synopsys 3DIC, Virtuoso or equivalent, AutoCAD, Siemens CalibreCan work both independently and in cross-functional teams for problem solving.

    US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

    Numbers & Facts

    LocationBloomington, MN

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