Advanced Packaging Process Integration Engineer

Job Details:

Job Description:

The Role and Impact

As a Process Integration and Yield Engineer, you will play a pivotal role in driving Intel's mission to deliver world-class semiconductor solutions. This role offers an exciting opportunity to define and execute technology transfer roadmaps, enabling the seamless integration of advanced packaging and backend assembly-test processes from new product introduction (NPI) to high-volume manufacturing (HVM) ramp. You will lead critical yield and quality improvement initiatives, ensuring optimal manufacturing performance. Your expertise will contribute to Intel's commitment to delivering innovative and reliable products that power the world's cutting-edge technologies.

Key Responsibilities

• Define and establish process flows, procedures, and equipment configurations to enable successful technology transfer.
• Analyze large volumes of structured and unstructured data, extracting actionable insights using statistical and machine learning methods, as well as coding tools such as SQL and Python.
• Drive yield improvement initiatives by identifying and resolving low-yield issues, engaging with both internal and external stakeholders.
• Implement continuous improvement programs to proactively prevent quality, line yield, and sort yield excursions.
• Perform quality and reliability risk assessments for manufacturing materials and process changes.
• Mentor and develop technical talent within the team, fostering a culture of innovation and collaboration.
• Act as a change agent to align organizational goals with technical strategies, driving innovation and leadership in the semiconductor industry.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree in Engineering, Material Science, Physics, or a related field with 4 or more years of relevant experience, or a Master's degree in Engineering, Material Science, Physics, or a related field with 3 or more years of relevant experience, or a PhD in Engineering, Material Science, Physics, or a related field with no experience.

Experience listed above should be a combination of the following:

• Process integration, yield analysis, and quality management in TD or high-volume manufacturing environments.
• Semiconductor advanced packaging and backend assembly-test process development.

Preferred Qualifications

• Data analysis tools and programming languages such as SQL, Python, or related coding tools.
• Proven ability to lead cross-functional problem-solving initiatives and drive results in a complex and fast-paced environment.
• Strong communication skills with the ability to effectively collaborate across diverse teams and stakeholders.
• Experience in value engineering and an innovative mindset to identify cost-effective solutions.
• A demonstrated track record of mentoring and developing technical talent in a professional setting.

Join us and seize the opportunity to shape the future of technology, make meaningful impacts on a global scale, and contribute to the advancement of the semiconductor industry.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, New Mexico, Albuquerque

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers'' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.