Advanced Packaging Technologist

MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession. Role and Responsibilities Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues * Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management #LI-NL1