Analysis Skills, Ball Grid Array (BGA), Communication Skills, Detail Oriented, Electronics Assembly, Hazardous Materials/Substances, High School Diploma, IPC Standards, Lift/Move 25 Pounds, Machine Tool, Manufacturing Assembly, Printed Circuit Board (PCB), Problem Solving Skills, Production Systems, Reduction of Hazardous Substances (RoHS), Safety Process, Soldering, Statistical Process Control, Surface Mount Technology, Team Player, United States Citizen, Wave Soldering