Adhesives, Ball Grid Array (BGA), Communication Skills, Cross-Functional, Debugging Skills, Detail Oriented, Electrical Components, Electronics Assembly, Identify Issues, Institute for Interconnecting and Packaging Electronic Circuits (IPC), Manufacturing, Mechanical Assembly, Organizational Skills, Problem Solving Skills, Procedure Implementation, Quality Metrics, Radiography, Reflow Soldering, Safety Standards, Soldering, Surface Mount Technology, Team Player, Test Equipment, Time Management, United States Citizen