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Assembly Packaging Technical Integrator - Intel Foundry Services MAG

Intel Corporation

Phoenix, AZ

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JOB DETAILS
SALARY
$164,470–$232,190 Per Year
SKILLS
Academic Research, Analysis Skills, Artificial Intelligence (AI), Assemblers Technology, Bill of Materials (BOM), Brand Marketing (Branding), Chemistry, Communication Skills, Computer Testing, Continuous Improvement, Cost Control, Cross-Functional, Customer Satisfaction, Data Analysis, Design Services, Documentation, Environmental Impact, Environmental Regulations, Illustrating Ability, Intel Product Family, Leadership, Logistics, Maintain Compliance, Manufacturing, Manufacturing Assembly, Manufacturing Design, Manufacturing Requirements, Material Science, Multitasking, Network Design, Optics, Organizational Skills, Package Layout Design, Physics, Problem Solving Skills, Process Engineering, Process Improvement, Product Design, Product Engineering, Product Packaging, Productivity Management, Prototyping, Quality Metrics, Regulations, Regulatory Compliance, Reliability Analysis, Research Skills, Risk Analysis, Semiconductor Manufacturing, Semiconductors, Statistical Modeling, Statistics, Stock Keeping Unit (SKU), Supply Chain, Sustainability, Team Player, Technical Leadership, Vendor/Supplier Evaluation
LOCATION
Phoenix, AZ
POSTED
Today
Job Details:

Job Description:

The Role and Impact
As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global customer base. This role places you at the intersection of engineering innovation and sustainability, ensuring Intel's products are safely transported while minimizing environmental impact. You will collaborate across diverse teams, including manufacturing, regulatory, logistics, and supply chain, to meet operationalgoals and drive continuous improvement. Your contributions will directly influence Intel's ability to deliver high-quality products efficiently, making you an essential part of our mission to shape the future of technology.

Key Responsibilities
  • Design, develop, and qualify packaging solutions and materials that meet product, regulatory, and environmental requirements.
  • Lead packaging development efforts, including creating artwork, prototypes, and detailed specifications.
  • Collaborate with cross-functional teams to ensure packaging solutions align with manufacturing, logistics, and supply chain needs.
  • Identify and implement cost-saving measures and processes to enhance efficiency, reduce waste, and promote sustainability.
  • Conduct risk analyses to ensure compliance with regulations and Intel's high-quality standards.
  • Partner with cross-organizational teams on SKUs, labeling, branding, and bills of material for product distribution.
  • Evaluate and qualify vendors to ensure scalability and high-quality manufacturing of packaging solutions.
  • Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis
  • Engages with customer and Drives programs to satisfy foundry customer needs.
  • -Create and maintain detailed technical specifications to ensure consistent and clear documentation.


Behavioral Skills:
  • Strong communication and collaboration skills with the ability to work effectively across internal teams, vendors, customers, and cross-functional stakeholders.
  • Strong analytical and problem-solving skills.
  • Ability to manage multiple priorities in a fast-paced technical environment.
  • Demonstrated ability to research, develop, and drive innovative technical solutions.
  • Strong organizational and documentation skills.


Qualifications:

Minimum Qualifications:
  • Bachelor's degree in Engineering, Material Science, Physics, Chemistry, or a related technical field.
  • 6+ years of experience with a Bachelor's degree, 2+ years with a Master's degree, or a PhD with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.


Additional Qualifications for Consideration:
  • Knowledge of Design for Manufacturing (DFM) principles.
  • Experience with semiconductor packaging assembly and production processes.
  • Experience with optical packaging technologies and semiconductor manufacturing environments.
  • Experience performing data analysis, statistical analysis, yield analysis, or package reliability analysis.
  • Experience working in cross-functional engineering and manufacturing environments.


Join our team and make an impact on Intel's packaging innovation and sustainability efforts. Apply now to shape the future of technology and leave your mark on a global scale.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Arizona, Phoenix

Additional Locations:
US, Oregon, Hillsboro

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

About the Company

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Intel Corporation

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