Position Summary
Job Description SummaryRole and Responsibilities
Here's what you'll be responsible for:
Set up the qualification plan to monitor the quality of product wafers that run through our tool for the first time after tool maintenance work
Respond to SPC interlocks after investigating for possible root cause
Determine and execute the plan for product wafers involved in tool faults, with partially processed wafers possibly requiring the creation of a modified recipe to complete the Wet Etch process
Investigate Manufacturing constraints as related to tool availability and product movement
Skills and Qualifications
Here's what you'll need:
2+ years of experience as a Process Technician or MFG specialist or an Associates Degree or equivalent Semiconductor experience
Prior experience with Cleans and Cu Electroplating Process experience is preferred (specifically with DNS, SEMES, TEL or FSI platforms)
Experience in analyzing SPC charts and trend charts is also a plus
Proficiency in Microsoft Office Suite (Excel, PowerPoint, Word)
The current base salary range for this role is between $18.60/hour - $60.40/hour. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.
Day Shifts Include:
A Shift – Sunday through Tuesday (6:45am – 7:15pm) with alternating Wednesdays
C Shift – Thursday through Saturday (6:45am – 7:15pm) with alternating Wednesdays
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