Co-Packaged Optics (CPO) Reliability Sr. Staff/Principal Engineer

MediaTek Inc
  • San Jose, CA
    30+ days ago

    Job Description

    We are seeking a high-caliber Co-Packaged Optics (CPO) Reliability Engineer to lead the reliability, qualification, and robustness assessment of next-generation co-packaged photonic and electronic systems. In this role, you will focus on the unique reliability challenges at the intersection of high-speed silicon switch ASICs and optical transport, driving qualification across the entire product Lifecycle. You will be responsible for defining accelerated testing methodologies, evaluating complex thermal/mechanical interfaces, and ensuring the seamless integration of optoelectronic components within advanced multi-die architectures. Key Responsibilities CPO Architecture Qualification: Architecture and execute comprehensive qualification plans at the module and system levels, ensuring strict compliance with GR-468 (Telcordia) and relevant JEDEC standards tailored for co-packaged environments. Advanced Packaging Reliability: Characterize and model the Reliability Failure Modes of Silicon / Packaging specifically targeting high-density 2.5D / 3D packaging, Multi-Chip-Modules (MCM), and ultra-dense electrical/optical interfaces. Component De-risking: Partner with design teams early in the NPI phase to establish Design for Reliability (DfR) and execute FMEA / DFMEA to mitigate risks associated with integrated Optical Engines, PIC (Photonic Integrated Circuits), and high-power III-V laser sources. Reliability Lifetime Modeling: Develop physics-of-failure and Reliability lifetime Modeling frameworks to evaluate wear-out mechanisms such as thermo-mechanical fatigue, electromigration, and optical degradation under mission-critical data center use conditions. Statistical Analysis & FIT Tracking: Utilize statistical software like JMP to analyze parametric drift, accelerated life testing (ALT) data, and calculate product FIT (Failures in Time) and MTBF metrics. Failure Analysis & RMA: Own root-cause failure analysis (FA) for qualification failures and field returns (RMA), leveraging advanced analytical tools to identify material, process, or design marginalities. Supply Chain Collaboration: Work closely with external ecosystems, including OSAT partners, contract manufacturers (CM), and foundry suppliers, to standardize test methodologies and audit factory-level quality controls.

    Numbers & Facts

    LocationSan Jose, CA

    Skills

    • ASIC (Application Specific Integrated Circuit)unmatched
    • Analysis Skillsunmatched
    • Contract Manufacturingunmatched
    • Design Failure Mode and Effects Analysis (DFMEA)unmatched
    • Ecosystemsunmatched
    • Electricityunmatched
    • Electro-migrationunmatched
    • Failure Analysisunmatched
    • Failure Mode and Effects Analysis (FMEA)unmatched
    • Joint Electron Device Engineering Council (JEDEC)unmatched
    • Maintain Complianceunmatched
    • Metricsunmatched
    • Network Operations Centerunmatched
    • Opticsunmatched
    • Optoelectronicsunmatched
    • Photonic Integrated Circuitsunmatched
    • Photonicsunmatched
    • Physicsunmatched
    • Product Lifecycleunmatched
    • Product/Service Launchunmatched
    • Quality Assurance Methodologyunmatched
    • Reliability Engineeringunmatched
    • Risk Managementunmatched
    • Root Cause Analysisunmatched
    • Statisticsunmatched
    • Statistics Softwareunmatched
    • Supply Chainunmatched
    • Thermal Analysisunmatched

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