Position would require the candidate to be a W2 employee of Donatech.
US Citizenship Required.
We are seeking a detail-oriented Mid-Level Component Engineer for a contract engagement to support our hardware development and manufacturing pipelines. In this role, you will be primarily responsible for evaluating electronic and mechanical component specifications, identifying compliance requirements, and defining precise packaging and handling (P&H) instructions to ensure component integrity throughout the supply chain. You may collaborate closely with procurement, quality assurance, engineering, and external suppliers to identify risks related to electrostatic discharge (ESD), moisture sensitivity, and physical damage.
Key Responsibilities:
Specification Analysis: Review and analyze component datasheets, engineering drawings, and technical specifications to understand physical, electrical, and environmental constraints.
Packaging & Handling Definition: Determine and document correct packaging methods (e.g., tape and reel, trays, tubes) and handling instructions based on industry standards and manufacturing requirements.
Moisture & ESD Management: Identify Moisture Sensitivity Levels (MSL) and Electrostatic Discharge (ESD) classifications to establish appropriate protective storage and handling protocols.
Supplier Collaboration: Potentially work with logistics, engineering, component manufacturers and distributors to resolve technical discrepancies regarding packaging configurations and shipping standards.
Database & Documentation Maintenance: Update internal component databases, Product Lifecycle Management (PLM) systems, and Approved Vendor Lists (AVL) with accurate packaging and compliance metadata.
Risk Mitigation: Identify obsolete packaging types, or non-compliant supplier practices and propose actionable alternatives to engineering and procurement teams.
Qualifications and Skills:
Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical discipline.
Experience: 3 to 5 years of experience in component engineering, hardware manufacturing, or quality engineering.
Technical Knowledge: Deep understanding of electronic component packaging types (SMD, Through-Hole, BGA, QFN) and industry standards such as IPC/JEDEC (e.g., J-STD-020, J-STD-033) and ANSI/ESD S20.20.
Software Proficiency: Hands-on experience using PLM software (such as PTC commonPDM) and component database tools (like SiliconExpert or Client Markit).
Attention to Detail: Proven ability to meticulously interpret complex technical datasheets and mechanical drawings.
Communication: Clear written and verbal communication skills needed to collaborate across cross-functional teams.