ADVERTISEMENT: Solar Technology LLC seeks Core Technologist, Wire Saw Subject Matter Expert to work in Hemlock, MI. Serve as technical expert to support wire saw operations & wafer slicing processes. Use diamond-coated wire saw to slice silicon wafers & improve solar wafer products. Identify opportunities for process optimization & drive process developments to improve yield, reduce costs, & enhance efficiency of solar wire saw operations & processes. Troubleshoot technical issues to identify root causes & implement corrective actions. Train engineers, technicians, & operators on solar wire saw operations. Req: bachelor’s in mechanical engineering, materials science, or chemical engineering, or closely related. 5 yrs. exp.: using diamond wire saw process to slice silicon wafers. 5 yrs. exp: working on diamond wire saw process equipment & determining technical issues to produce high quality wafers; troubleshooting & problem-solving issues w/ diamond wire saw equipment; & working w/ diamond wire quality & wire saw equipment components to understand the impact on wire saw process & wafer quality. Send resume referencing “2772” to Cassandra Tuckey at careers@corning.com or One Riverfront Plaza, Corning, NY 14831.
Rate of Pay: $157,000/year