Defect Metrology Process Engineer - Sr. Staff

Position Summary:We are looking for a Defect Metrology Process Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve AOI and Metrology processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.Major Area of Accountability:

Coordinate the integration of our metrology systems into our site MES and automation systems.Implement and maintain metrology support systems, such as add-on software packages and data collection archiving.Ensure metrology supports multiple fab areas with thickness and defect measurements, inspection of pillar heights and location, as well as AFM and profilometry.Daily review of defects and SPC data for excursions, disposition and drive yield improvements in layout and process.Coordinate with appropriate engineering areas to report die pad locations through automation in fan-out wafer level packaging applications.Investigate and drive integration changes for improved device performance and yield improvement.Work with process and tool engineers to find processing marginalities and make improvements.The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:Education: BS, MS or PhD in Electrical Engineering, Electronics Engineering, or a related BS Engineering, MS/PhD preferredExperience and Skills:

8+ years' experience with BS, 5-8 years of experience with MS, 3+ years of experience with PhD in Electrical Engineering, Electronics Engineering, or a related in the semiconductor industry.Fab processing tools knowledge/experience and how to support defect feedback to process owners.Prior Defect inspection experience.Defect Management System configuration and administration (such as Klarity, Odyssey, Discover).MES configuration familiarity (INGRES, OpCenter, Workstream, PROMIS, etc)Proficient with macro AOI (golden die inspection systems).Experienced with recipe-based execution of metrology methods in the fab (ellipsometry, reflectometry, profilometry, AFM, & CSAM).Prior experience with layout and reticle data prep processes as a metrology stakeholder.

MEMS/CMOS/Packaging inspection and metrology knowledge with relevant combination of years of experience and/or advanced degree.Knowledge of DOE, SPC, and 6-sigma concepts and applications.Project Management skills and/or defined training a plus.US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.