Digital ASIC Architect

Define the digital architecture behind Apples next generation of motion-aware experiences. The Motion Sensing Hardware organization designs the IMUs, magnetometers, pressure sensors, and other sensing ASICs that enable spatial computing, gesture input, head-tracked audio, and crash and fall detection across iPhone, iPad, Apple Watch, AirPods, and Vision Pro. The architectures and hardware our team invents are what become the features customers feel first. If you want to set the direction for what motion sensing on Apple products can do, this is your team. As a Digital ASIC Architect on the Motion Sensing Hardware team, you will own the digital architecture of motion sensing ASICs from concept through silicon, with the goal of delivering best-in-class sensing experiences across Apples product line. You will analyze the application, then define cost and power optimized digital systems built around one or more processors, DSP cores, and custom control engines. You will translate high-level user and product requirements into a realizable system, build the high-level models that prove out the architecture, and author the detailed specifications that drive the rest of the IC development. This is a highly cross-functional role. You will work with circuit design, firmware, algorithms, software, and product teams to identify the critical interactions between the ASIC and the broader product, and you will produce the architectures and specifications that become the silicon Apple ships and the features customers feel.Define the digital architecture needed to achieve the module ERS, including evaluation and down-selection of processor, DSP, memory, and interface IP and topologies against performance/power/area/risk Perform trade-off analysis and interface with the Analog ASIC Architect, MEMS Architect, Firmware Lead, and SoC team for system-level architectural decision making Define hardware/firmware partitioning, memory hierarchy, bus topology, clock and power domain structure, and peripheral integration Lead digital architecture reviews with vendor and internal stakeholders Develop sensing algorithms and signal processing pipelines, and build high-level models in MATLAB, Python, or SystemC to predict performance before RTL exists Co-simulate digital with a behavioral analog front-end and MEMS model to validate full system interaction, then correlate models against first silicon to close the loop for the next iteration Author IP-level and IC-level specifications that anchor design, verification, and characterization, including: Processor, DSP, memory, bus, and custom control-engine requirements Clocking, reset, power management, and I/O / peripheral specs Host SoC and sensor AFE interface definitions Drive defect root cause analysis and resolution from bring-up through mass production Document architectural assumptions, open items, known risks, and waiver justifications for tape-out readiness sign-off Communicate program status, technical issues, risks, and mitigation plans clearly and concisely Minimal business travel as needed to support product developmentBS in Electrical Engineering or related field with a minimum of 10 years of relevant industry experience Excellent written and verbal communication skillsDeep expertise in digital ASIC architecture for sensor or mixed-signal systems, including processor and DSP sub-system definition, memory and bus architecture, and custom control engine micro-architecture Proven track record of defining and taping out high-volume, complex digital and mixed-signal ICs from architecture through production Strong foundation in system-level design, requirements development, and hardware/firmware partitioning for sensing or low-power embedded applications Experience developing sensing algorithms and signal processing pipelines, with the modeling skills to evaluate them before silicon Experience with IC bring-up, silicon characterization, and system-level debug Proficiency in MATLAB, Python, C/C++, or SystemC for high-level modeling and simulation