Lumotive is pioneering the era of programmable optics—where light is controlled as intelligently and flexibly as software.
At the heart of this transformation is a once-in-a-generation innovation: a flat CMOS-based “general purpose optic.” Lumotive’s Light Control Metasurface (LCM) beam forming chips can be programmed to function as a beam steering mirror, a lens, mirror, a beam splitter—or any optical function—replacing bulky and mechanical optical components with a fully digital, reconfigurable semiconductor . This breakthrough lays the foundation for a massive shift in multiple technologies—from 3D sensing and imaging to optical networking, free space optical communication, and beyond. Like the shift from analog to digital in electronics, programmable optics will reshape industries from robotics, self-driving cars, AI, defense, and healthcare.
Lumotive’s first commercial application is in LiDAR, where its software-defined beam steering chips are already enabling compact, high-performance, solid-state sensors. These sensors are being deployed today in smart infrastructure, robotics, and mobility systems through leading module makers and solution integrators.
With more than 200 patents and growing commercial traction, Lumotive is delivering the world’s first digital platform for light—and redefining what’s possible in the optical age.
Job Description:
Lumotive is seeking a highly experienced and hands-on Director of Analog to lead the development of next-generation analog circuitry for Beam steering mixed-signal ASIC controllers. This leadership role is critical in defining and driving the development of active transistor matrix arrays and analog channel driver technologies in close collaboration with optical and ASIC design teams.
You will oversee the full life cycle of mixed-signal IPs—from architecture definition, design, and layout to tape-out, silicon bring-up, and mass production. This role requires a seasoned technical leader with deep domain expertise, exceptional problem-solving skills, and the ability to thrive in a fast-paced, interdisciplinary environment.
Responsibilities:
- Lead the architecture, design, and development of analog and mixed-signal IPs for beam steering applications.
- Manage and lead a team of analog mixed circuit and analog design engineers.
- Collaborate with cross-functional teams including optics, digital/ASIC, packaging, and testing to ensure robust integration of analog systems.
- Drive the design and optimization of key functional blocks such as DACs, ADCs, LDOs, row/column drivers, and output buffers.
- Oversee simulations, physical implementation, tape-out, and bring-up of mixed-signal ICs.
- Provide hands-on technical guidance and mentorship to the analog design team.
- Interface with foundry partners to evaluate and select optimal CMOS process nodes.
- Ensure successful silicon validation and characterization through lab measurements and debugging.
- Contribute to the development and execution of the technology roadmap for analog and mixed-signal IP.
Qualifications:
- PhD or MS in Electrical Engineering or related field with 10+ years of experience in analog and mixed-signal IC design
- At least 8 years of prior people management experience.
- Proven track record of delivering first-pass functional silicon for complex mixed-signal ASICs, especially in CMOS technologies optimized for image sensors or display drivers.
- Deep understanding of analog display driver circuits including active-matrix architectures, row/column drivers, DAC/ADC design, LDOs, and output buffers.
- Strong expertise in low-power, high-precision analog design techniques.
- Hands-on experience with transistor-level design tools (e.g., Cadence Virtuoso, AMS design flows).
- In-depth knowledge of process technology and device physics, preferably from leading foundries.
- Proficiency in lab testing and silicon debugging using oscilloscopes, spectrum analyzers, signal generators, etc.
- Experience with active-matrix display systems and analog circuit characterization.
- Exceptional communication skills, both verbal and written, with the ability to present complex technical concepts clearly.
- Demonstrated leadership in managing and mentoring high-performing analog design teams.
- Experience in high-volume production and yield optimization of analog/mixed-signal chips.
- Familiarity with multi-stack die technology, including through-silicon vias (TSVs), wafer-to-wafer bonding, and 3D integration techniques
$200,000 - $230,000 a year
Benefits include but not limited to:
Health, dental and vision
FSA, HSA
PTO plus 14 paid company holidays
401K with 3% contribution
Stock Options
Life insurance and disability