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Skills
Assembly Drawingsunmatched
Ball Grid Array (BGA)unmatched
Bill of Materials (BOM)unmatched
Calibrationunmatched
Cleaning Equipmentunmatched
Document Managementunmatched
Documentation Standardsunmatched
Electronicsunmatched
Electronics Assemblyunmatched
IPC Standardsunmatched
Machine Toolunmatched
Military Electronicsunmatched
Printed Circuit Board (PCB)unmatched
Process Developmentunmatched
Process Improvementunmatched
Record Keepingunmatched
Schematicsunmatched
Socketsunmatched
Software Configuration Managementunmatched
Solderingunmatched
Surface Mount Technologyunmatched
Technical Supportunmatched
Traceabilityunmatched
Description
Qualifications:
Technical certificate, associate degree, military electronics training, or equivalent hands-on electronics experience.
Demonstrated experience performing board-level electronic assembly, soldering, component replacement, and printed-circuit-board repair (through-hole and surface-mount).
Hands-on ability with repair tooling such as microscopes, soldering and desoldering systems, hot-air tools, preheaters, and board-cleaning equipment.
Ability to execute controlled board-level repair and rework to approved procedures and engineering instructions, including inspection for damage, contamination, and workmanship defects.
Experience maintaining product and component traceability and following controlled processes, including stopping work and escalating when scope exceeds authorization.
Experience with BGA removal, site preparation, replacement, reballing, thermal-profile execution, and post-rework inspection.
Ability to read and follow schematics, assembly drawings, bills of material, repair instructions, engineering dispositions, and component markings.
IPC J-STD-001, IPC-A-610, IPC-7711/7721, or equivalent certification (preferred).
Responsibilities:
Perform controlled board-level repair, component rework, mechanical modification, cleaning, inspection, and preparation of assemblies for retest using released procedures and engineering dispositions.
Execute component removal and replacement, jumper installation, connector and socket replacement, and other authorized rework; inspect for damaged traces, pads, vias, contamination, and workmanship defects.
Own day-to-day readiness and operation of the BGA rework capability, including equipment setup, tooling, profiles, software configurations, calibration status, consumables, and associated records.
Maintain complete records and traceability for work performed, components replaced, settings used, rework cycles, inspection results, and final outcomes; route repaired units to qualified test owners and support retest when requested.
Support Engineering and Quality with process development and improvement, assist with controlled documentation and standard work, and escalate when instructions are unclear or unexpected damage is found.