Amkor Technology is seeking an IC Package Design Engineer for its Tempe, Arizona location. This role is responsible for developing high-quality IC package designs, creating detailed engineering drawings, and supporting multiple design-related activities within the Design Center. The engineer collaborates with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements.
Essential Duties and Responsibilities:
Design laminate (BGA) and wafer-level semiconductor packages, including determination of design rules, optimization, verification, and package selection based on thermal, mechanical, and electrical requirements.
Create accurate and detailed engineering drawings with minimal supervision.
Analyze and resolve design challenges and customer-related technical issues using sound engineering principles.
Identify opportunities to improve design methodologies, processes, and technologies.
Exercise sound judgment when making design-related decisions and recommendations.
Build and maintain effective partnerships with customers and cross-functional teams to support quality and productivity objectives.
Collaborate with Amkor Product Group and Sales teams to ensure customer requirements are understood and achieved.
Interface with internal and external customers to support design reviews, technical discussions, and project execution.
Prepare technical documentation and maintain accurate engineering records.
Demonstrate a continuous learning mindset and contribute positively to team development and knowledge sharing.
Perform other duties as assigned.
Required Qualifications:
Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
Experience using CAD or similar engineering software to create and maintain technical drawings.
Strong verbal and written communication skills.
Ability to manage multiple tasks and complete assignments effectively with minimal supervision.
Self-motivated, detail-oriented, and able to work collaboratively in a team environment.
Demonstrated ability to meet project deadlines and manage priorities in a fast-paced setting.
Preferred Qualifications:
Experience in semiconductor packaging design.
Experience using package design and simulation tools such as Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350.
PCB design experience.
Working knowledge of Geometric Dimensioning and Tolerancing (GD&T) practices.
Signal Integrity (SI) and Power Integrity (PI) analysis experience.