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Skills
Analysis Skillsunmatched
Bit Error Rate (BER)unmatched
Cross-Functionalunmatched
Earned Value Management (EVM)unmatched
High Power Amplifier (HPA)unmatched
IP (Internet Protocol)unmatched
Impedance Matchingunmatched
Integrated Circuits (ICs)unmatched
Laboratoryunmatched
Microwavesunmatched
Network Performance/Analysisunmatched
Oscilloscopeunmatched
Power Amplifierunmatched
Problem Solving Skillsunmatched
Radio Frequencyunmatched
Schematicsunmatched
Solderingunmatched
Spectrum Analyzersunmatched
Systems Administration/Managementunmatched
Testingunmatched
Time Managementunmatched
Description
Engineering Lab Technician
Job Description:
Will require a proven background working with RF and microwave products that operate from DC to 50 GHz. Product background must consist of a strong working knowledge with driver amplifiers, low noise amplifiers, high power amplifiers, buffer amplifiers, digital and analog attenuators both serial and parallel, dividers, detectors, frequency multipliers, VCO's, mixers, modulators/demodulators, multi-function modules, digital and analog phase shifters, switches, PIN diodes, and synthesizers.
Requires tuning/improving/changing the products mentioned to present solutions for desired customer/engineering requirements.
Must have understanding and practical knowledge of working with the Smith Chart for impedance matching.
Use of lump elements such as capacitors, inductors, and resistors to perform product tuning or enhancement as well as transmission line tuning is desired.
The ability to solder small case size components to evaluation boards with use of a microscope is desired.
The knowledge in the use of a laser to cut out MMIC circuitry would be desirable.
Thorough understanding of a variety of microwave measurements which include but are not limited to IP3, IP2, P1dB, harmonics, DC and/or RF pulse power, S-Parameters including balanced, noise figure, ACPR, EVM, bit-error rate, jitter (using eye diagrams), switching speed, conversion loss/gain, isolation, group delay, composite triple beat, composite second order, and stability testing.
Must have a background and a working knowledge to operate and perform test set-ups using such equipment as spectrum analyzers, network analyzers, mixed signal and sampling oscilloscopes, signal generators, pulse generators, curve tracers, noise figure meters, power supplies, power meters, SMU's, and multi-meters. Wafer probing and testing on die experience is required for characterizing products.
Ability to solve problems independently as well as in a team environment.
Troubleshooting both to the component level and test system set-ups, the use of circuit analysis techniques to identify IC failures, and applying solid problem solving techniques to resolve issues in a timely manner are expected.
Understanding of IC layouts, circuit schematics, and block diagrams are desired for this position.