TYLsemi is developing purpose-built connectivity chiplet for HPC/rack-scale AI systems. We are seeking a Principal Engineer Ethernet Scale-up to lead the architecture and design of next-generation Ethernet Scale-Up Networking (ESUN) solution. This is a high-impact technical role.
What You'll Do
Define architecture for Ethernet-based AI scale-up interconnects and accelerator fabrics.
Lead development of high-performance Ethernet Subsystem microarchitectures including RDMA, packet processing, network offload, traffic management, congestion control, and reliability mechanisms.
Drive execution from architecture through RTL, verification, physical design, silicon bring-up, and production.
Optimize performance, latency, scalability, power, and reliability for demanding AI and HPC workloads.
Collaborate across hardware, firmware, software, and system teams to deliver industry-leading AI networking solutions.
Serve as a company-wide technical leader, influencing product strategy, roadmap, and architectural direction.
What We're Looking For
15+ years of ASIC/SoC architecture and design experience.
Proven track record delivering networking, NIC, switch, DPU, accelerator interconnect, or high-speed connectivity silicon.
Deep expertise in SystemVerilog/RTL design and high-performance datapath architecture.
Strong knowledge of Ethernet, RDMA, traffic management, congestion control, and scalable fabric architectures.
Experience across the full ASIC lifecycle, from architecture to production silicon.
Good to Have
Ultra Ethernet, UALink, RoCEv2, InfiniBand
PCIe Gen6/Gen7, UCIe, CXL
AI/HPC interconnects and collective communication acceleration
400G/800G/1.6T Ethernet systems
High-speed SerDes and advanced networking architectures
Success in This Role Looks Like
Ethernet Scale-Up Networking architecture is defined and validated for next-gen HPC/rack-scale AI systems, with clear technical direction across accelerator fabrics.
High-performance Ethernet subsystem microarchitecture (RDMA, packet processing, offload, traffic management, congestion control) is delivered on schedule and meets production-quality reliability bars.
Programs move cleanly from architecture through RTL, verification, physical design, and silicon bring-up with minimal rework.
Performance, latency, power, and reliability targets are met or exceeded for demanding AI/HPC workloads.
Cross-functional teams (hardware, firmware, software, systems) are aligned and unblocked, with this role recognized as a trusted technical authority shaping product strategy and roadmap.
Compensation: The compensation range shown below represents total target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.
In addition to cash compensation, this position is eligible for equity in the form of stock options, giving you the opportunity to share in the Company’s long-term growth and success.
Numbers & Facts
Location
San Jose, California
Skills
ASIC (Application Specific Integrated Circuit)unmatched
Architectural Servicesunmatched
Artificial Intelligence (AI)unmatched
Computer Firmwareunmatched
Cross-Functionalunmatched
Datapath Designunmatched
Design Servicesunmatched
Ethernetunmatched
Exceeded Sales Goalunmatched
National Intelligence Council (NIC)unmatched
Network Architecture/Engineeringunmatched
Network Monitoringunmatched
PCI Express (PCI-E)unmatched
Packet Processingunmatched
Performance Tuning/Optimizationunmatched
Product Planningunmatched
Product Strategyunmatched
Production Scheduleunmatched
RTL Designunmatched
RTL Verificationunmatched
SERDESunmatched
Silicon Bringupunmatched
System-on-a-Chip (SoC)unmatched
SystemVerilogunmatched
Technical Leadershipunmatched
Time Managementunmatched
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