Responsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.
DUTIES/RESPONSIBILITIES:
Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques
Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features
Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales
Analyze images to identify defects, fractures, corrosion, and other anomalies
Analyze data collected from various analyses to develop comprehensive understanding of failure mechanisms
Generate detailed reports outlining findings, analysis methodologies, and recommendations
Utilize spectroscopic methods to identify material compositions and elemental distributions
Perform mechanical and thermal testing
Prepare reports and documentation of failure analysis results
Work with other engineers and scientists to develop and improve the failure analysis process
Participate in quality control procedures, including instrument calibration and performance check
Troubleshoot technical issues
Provide support to the OQA function with analysis results
REQUIREMENTS:
Experiences on SEM / FIB equipments (Analysis tools)
Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)
Excellent analytical and problem-solving skills to identify root cause of failures
Strong attention to detail and ability to accurately document findings and observations
Excellent communication skills and a proven ability to juggle multiple high priority tasks
QUALITIFICATIONS:
Strong knowledge of electronic devices and their failure mechanisms
Experience with a variety of failure analysis techniques
Proficiency in microscopy techniques, material analysis, and spectropy
Strong understanding of material properties, fracture mechanics, and root cause analysis
Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)
EDUCATION:
Bachelor's degree in material science, electrical engineering, or related field
EXPERIENCE:
0+ years of experience in physical failure analysis in electronic or semiconductor applications