Head of IC Design

Description

Role Purpose

Lead Power Integrations' global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.

This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.

Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.

Business Ownership & Impact

• Own execution and delivery of all IC development programs.
• Ensure predictable silicon delivery aligned to product commitments.
• Drive improvements in:

o First-pass silicon success

o Development cycle time

o Design productivity and reuse

• Balance design innovation with execution risk and schedule confidence.
• Ensure designs meet:

o Performance targets

o Cost and area targets

o Manufacturability and yield requirements

Core Responsibilities

IC Design Execution & Delivery

• Lead all IC development across:

o Analog design

o Digital design

o Mixed-signal integration

o Design verification

o CAD/Layout

o Design reuse

• Ensure high-quality execution from specification through tape-out and silicon validation.
• Deliver designs that meet schedule, performance, cost, and quality targets.

Alignment to Product & Marketing Requirements

• Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
• Provide early input on feasibility, risk, and trade-offs.
• Maintain alignment between architecture intent and silicon implementation.

Design Methodology & Productivity

• Establish best-in-class design methodologies, tools, and flows.
• Drive improvements in:

o Design reuse

o Verification coverage

o Silicon iterations

o Time-to-functioning silicon

• Build scalable design infrastructure to support future growth.

Cross-Functional Integration

• Partner closely with:

o Product & Technology (architecture and requirements)

o Marketing (roadmap alignment)

o Operations (process, yield, cost, backend execution)

o Business Units (application needs and priorities)

• Ensure tight alignment between design, manufacturing, and system requirements.

Risk Management & Predictable Execution

• Implement disciplined design and verification processes to reduce execution risk.
• Identify and manage technical risks early in the development cycle.
• Ensure high confidence in tape-out schedules and silicon success.
• Drive a culture of accountability and delivery predictability.

Organizational Leadership

• Lead global IC design teams across regions.
• Build a strong technical culture focused on:

o Quality

o Execution discipline

o Risk management

o Design reuse

o Continuous improvement

• Recruit, develop, and retain top engineering talent.

Ideal Profile

• 15+ years of experience in IC design (analog, mixed-signal, or power ICs).
• Proven leadership of global IC design teams.
• Deep expertise in:

o High-voltage / power IC design

o Mixed-signal integration

o Semiconductor processes (BCD, HV, GaN preferred)

• Strong track record of delivering silicon on schedule with high quality.
• Experience improving design productivity and execution predictability.
• Strong cross-functional collaboration skills across product, marketing, and operations.