Head of Physics AI - Thermal-Mechanical Reliability

Flexcompute is the physics company. We bridge first-principles physics and neural foundation models to redefine the boundaries of industrial simulation and design. We believe that the next era of engineering will be defined by the convergence of massive parallel computing and artificial intelligence.

Our core technology features the world's fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don't just make simulations faster; we make the "impossible" solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond.

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world's fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry's most critical bottleneck: the structural and thermal integrity of advanced packaging.

Key Responsibilities:

• Lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. • Define the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale. • Develop and implement innovative solutions that leverage our world's fastest GPU solvers and Physics AI Foundation Models.

You aren't just using tools; you are defining the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale.