HPC Interposer & 2.5D/3D Packaging Design Engineer

yochana

Fremont, CA

JOB DETAILS
SKILLS
3D Design, Communication Skills, Computer Networks, Design Verification, Problem Solving Skills, Substrate Design, Technical/Engineering Design
LOCATION
Fremont, CA
POSTED
1 day ago

Yochana is seeking a highly skilled Silicon Substrate Design Engineer to lead physical design and layout for next-generation 2D, 2.5D, and 3D packaging architectures. This role involves collaboration with various teams to ensure robust interconnect solutions for high-performance computing and networking applications.The ideal candidate will have experience with advanced silicon interposer technologies and a strong background in layout design and verification tools. Strong communication and problem-solving skills are essential for this position.#J-18808-Ljbffr

About the Company

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yochana