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As a Field Process Engineer supporting PEALD Plasma-enhanced Atomic Layer Deposition (PEALD) and Plasma-enhanced Chemical Vapor Deposition (PECVD) on ASM’s XP8 DCM/QCM platforms, you will act as the on‑site process expert at customer HVM fabs. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing.