HVM Field Process Engineer – tALD, Epitaxy, Vertical Diffusion

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For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

HVM Field Process Engineer – tALD, Epitaxy, Vertical Diffusion

As a member of the Global Sales and Services business unit, our Field Process Engineering team is the on-site process application expert in improving process performance and stability on our tool sets at our customer locations.  In this role you will be supporting Thermal Atomic Layer Deposition (tALD), Epitaxy or Diffusion on ASM’s XP8 DCM/QCM, Intrepid or Sonora platforms. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing.

The Field Process Engineer is a key customer interface and must demonstrate responsibility and proper communication when interacting with the customer. Delivering customer satisfaction is a key objective in this role. Engineers in this role often transition into technical leadership, customer strategy, or product development roles. You’ll have visibility across ASM’s global innovation teams and access to advanced R&D resources.

Key Responsibilities

• Lead on-site process qualification and optimization during tool installs and ramp‑up.
• Trace achievement of customer specifications through installation, ramp, and warranty phases.
• Execute structured DOEs to improve film quality, uniformity, and throughput.
• Troubleshoot process issues using systematic root‑cause analysis. Drive containment, short‑term mitigation, and long‑term corrective actions to ensure customer requirements are met.
• Partner with customer and ASM teams to drive continuous improvement and tool‑to‑tool matching.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders – especially sharing lessons learned within our key account organization and Global Sales and Services business unit.

Customer Engagement

• Serve as a primary technical interface between customer process teams, hardware teams, and ASM account teams.
• Anticipate needs and provide sustainable, long-term solutions.
• Support escalations with clear communication, action plans and disciplined follow‑through.
• Represent ASM with professionalism and technical credibility.

What Makes You Successful

• Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure.
• Highly collaborative, organized, and proactive in solving issues and driving improvements.
• Strong sense of ownership, accountability, and empathy for customer challenges.
• Adaptable to changing priorities in a high‑volume manufacturing environment.

Qualifications

• Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields.
• Experience with deposition processes (tALD/Epitaxy/Diffusion), vacuum systems, metrology, and semiconductor manufacturing.
• Preference for candidates with HVM experience, ideally on ASM platforms.
• Strong DOE and experimental analysis skills.
• Ability to travel up to 25%, as necessary and possibly for extended periods of time for training and technical engagement, as well as to other Customer sites, as needed.
• In case of escalations, additional hours and working weekends may be required.
• Strong understanding of IP boundaries and confidentiality requirements