IC Package Integration Lead

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and theres no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.

• Work with cross-functional teams and lead package integration and architecture efforts.
• Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
• Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
• People managerial skills highly desirable.
• Travel - 5-10%Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements. Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost) Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production. Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.BS and 20+ years of relevant industry experience.We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA. Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable. Excellent problem solving with strong physics and fundamentals. Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost. Ability to work independently and take on projects with minimum supervision. Ability to lead and manage teams.