Location : Chandler, AZ (primary) or Hillsboro, OR (secondary)Experience Tier: Senior-level (primary); Mid-level (secondary)Senior-Level: ~10+ years in IC packaging / package designMid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package designIC Packaging Design EngineerSkills RequiredThis client is looking for a high level IC Package Design Engineer to help with a new product. Bachelor's or Master's degree in Electrical / Electronics Engineering is required.ExperienceStrong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutDesign for performance, manufacturability, yield, and reliability#J-18808-Ljbffr