Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products.
As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.
Package Characterization: Design and execute testing of IC packages under rigorous environmental and reliability stress conditions, including dynamic mechanical loading, thermal cycling, and moisture stressing.
Material Evaluation: Lead the characterization of advanced packaging materials (e.g., solders, polymers, dielectrics) and manage material characterization activities at external suppliers.
Methodology Development: Develop novel experimental methodologies, including designing custom fixtures, setting up specialized test equipment, and integrating advanced data acquisition systems.
Failure Analysis: Drive root-cause analysis and troubleshooting for complex packaging-related yield and reliability issues.
BS and a minimum of 10 years relevant industry experience or equivalent
BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.
We’re a diverse collection of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. The people who work here have reinvented entire industries with the Mac, iPhone, iPad, and Apple Watch, as well as with services, including iTunes, the App Store, Apple Music, and Apple Pay. And the same passion for innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it.
There’s a place here for every kind of brilliant. Everyone here is an innovator, or an innovator-to-be, no matter what your team or your role. So bring your passion, courage, and original thinking and get ready to share it, because every new product, service, or feature we invent is the result of people working together to make each others’ ideas stronger. Innovation at this level depends on people who represent the variety of the human experience and inspire us with their own fresh perspectives. Together, we’ll do amazing work that can make a difference in people’s lives. Including your own. Learn more about working at Apple.