IC Packaging Engineer - WLP

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects. Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. Youll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. Youll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. Were looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.Support packaging technology development, including advanced 2.5D / 3D packaging Contribute to multi-functional SoC package integration efforts - design, test, characterization, reliability, and product teams. Participate in package architecture trade-off studies and prototype evaluations. Collaborate with foundry and OSAT partners on build execution, DOEs, and data analysis. Own well-scoped technical deliverables (characterization, modeling, failure analysis, product development) end-to-end 5% International travelMinimum requirement of a bachelors degreeMS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab. Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards. Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc. Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers Ability to work independently and orchestrate projects with cross functional teams Solution-oriented mindset with strong fundamentals in engineering physics Good program management skills.