Broadcom Inc. in Irvine, California is seeking a talented engineer to develop and enable advanced packaging technology for AI-related products. The position focuses on integrating memory dies and SoC dies into a single package.Required qualifications include a M.S. degree with at least 10 years of relevant experience and a strong grasp of 2.5D/3D technology development. The role offers a competitive salary and comprehensive benefits, including medical plans and401(K) matching.#J-18808-Ljbffr