Lead Package Assembly Integrator
In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with package and system architects to incorporate manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.
Responsibilities:
• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry and OSAT partners. • Develop and execute package architectures and designs, ensuring they meet rigorous product performance standards while optimizing for manufacturability and long-term reliability. • Define test chip requirements and manage test chip design required for 3D package process development. • Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas. • Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions. • Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity. • Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required. • Write reports and document methodologies.
Required Qualifications:
MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
10-12 years of experience in wafer scale packaging assembly process development.
Knowledge of 2D/3D packaging technologies, materials, and equipment requirements.
Proven ability to define requirements for test chip and assembly test vehicles.
Understanding of photonics packaging requirements including various fiber attach methods.
Experience with advanced packaging technologies, including thermal, mechanical, and reliability factors.
Preferred Qualifications:
Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
Strong project ownership, with a history of driving results independently and with minimal supervision.
Proven track record of developing creative solutions for complex technical challenges.
Experience in thermal and mechanical modeling and coding for data analysis.