MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration across various teams to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications. Ideal candidates will demonstrate strategic thinking and strong ownership skills.The position involves identifying optimal package architectures and performing trade-off analyses while engaging with internal and external partners. Extensive hands-on experience in advanced semiconductor packaging is essential.Salary range: $171,000 - $272,000, plus benefits.#J-18808-Ljbffr