Intel is seeking a Packaging Module Development Engineer to advance technology in semiconductor packaging. The role involves developing interconnect and thermal solutions, managing projects, and providing support for equipment performance in a high-volume manufacturing environment.The ideal candidate will have a PhD or Master's degree in a related field and at least 1 year of experience in mechanical design or manufacturing systems. An annual salary range of $115,110.00 to $219,550.00 USD is offered with competitive benefits.#J-18808-Ljbffr