Lead/Principal MMIC Design Engineer

Seeking a Lead MMIC Design Engineer for an exciting opportunity with the MMIC Technology Center organization under Honeywell Aerospace Inc., located in our Richardson, TX location! The MMIC Technology Center creates advanced RF solutions for internal and external customers. The Center has PMO, production test and support engineering to convert designs into delivered products as well as systems expertise to support customer architecture and trade studies at board and sub-array levels. Consider joining us! Apply today.

Work in a team environment to develop innovative, leading-edge GaN / GaAs technology MMICs ; ground and airborne-based radars, electronic warfare and space applications ranging from L-band to above Ka-band; assist in architecture development and feasibility studies; assist in advanced package concepts through development; perform modeling, simulations, and analyses necessary and hold successful design reviews with customers; assist in mask release to the foundry; assist in manufacturing & test readiness; work in lab alongside technicians to assist in validation & device characterization testing; prepare technical reports; collaborate with various organizations and cross-functional teams; work with internal and external vendors as required; support or lead in IR&D efforts; apply appropriate standards, processes, procedures and tools throughout the system development life cycle

MUST HAVE:

• BSEE plus ten (10) years of MMIC design experience using GaAs or GaN technologies, or MSEE plus eight (8) years of design experience.
• Coursework relating to RF design or Electromagnetics (RF theory).
• Knowledge in active device theory fundamentals (FETs and diodes).

WE VALUE:

• Masters of Science in Electrical Engineering (MSEE) or PhD
• Ten (15) years of MMIC design and DoD industry experience.
• Expert use of design tools such as AWR or ADS simulation software.
• Advanced knowledge and experience in microwave measurement theory and hands-on experience in the lab.
• Advanced knowledge in FET transistor and circuit theory.
• Experience user of AutoCAD or Ansys Solidworks.
• DOD work experience.

US PERSON REQUIREMENTS

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status.

About us:

Join a company that''s reintroducing itself to the aviation community we''ve helped advance for more than a century. At Honeywell Aerospace (NASDAQ: HONA), we''re launching as an independent, publicly traded aerospace and defense company built on a legacy of operational excellence and mission-focused execution.

Our new brand identity pairs that heritage with real momentum, as we build technology that helps pilots navigate with confidence, aircraft operate more efficiently, and operators stay ahead of change. With our systems on board 90% of the world''s aircraft, your work here has reach that''s rare to find anywhere else.

Focusing on our customers, investing in innovation, and building a culture of accountability and performance is how we''re shaping what comes next.

Every horizon. Every mission. Every day.

BENEFITS

Beyond a performance-driven salary, you''ll work alongside dedicated experts on technology that''s advancing aviation. As a Honeywell Aerospace employee, you''re eligible for a comprehensive benefits package that includes:

• Employer-subsidized medical, dental, vision and life insurance
• Short-term and long-term disability coverage
• 401(k) match, flexible spending accounts and health savings accounts
• Employee assistance program and educational assistance
• Parental leave and 12 paid holidays
• Paid time off for vacation, personal and sick time

Explore your benefits: https://honeywellaerospacebenefits.com/

POSTING TIMELINE

The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates.

• Perform line-up analysis, floor planning, FET device selection, and circuit topology studies necessary to meet customer requirements.
• Perform circuit simulation, analyses, and layout as part of the design flow methodology.
• Perform circuit modeling and simulations using foundry PDK models (linear, non-linear, and EM).
• Perform 3D modeling and simulations for packaging MMIC's; work with drafters and PCB designers to develop packages and/or multi-chip modules.
• Perform simulations using Cadence/AWR AXIEM 3D planar EM and Analyst 3D FEM tools.
• Perform analyses required to achieve reliability & manufacturing compliance.
• Prepare for design reviews and preparing for manufacturing and test readiness.
• Perform RF/Microwave measurements in the lab using PNA-X and related equipment.
• Lead Engineer to assist in planning, reporting, and meeting performance, cost, and schedule objectives on programs.
• Identify & initiate improvements in the design methodology flow
• Engage and forge relationships with foundries, advanced processes & packaging suppliers in order to advance our capabilities
• Assist in business development pursuits to help shape customer requirements and system architecture trades.
• Technical lead role; prepare flow-down specifications and floor planning requirements; prepare project status to Program Management and Engineering Manager.
• Assist in IR&D roadmaps and lead IR&D projects
• Identify and contribute in continuous improvement initiatives
• Assist in technical write-ups for proposals and white papers
• Mentoring Engineers
• Support Engineering team in customer support activities and preparing technical reports
• Lead and collaborate team meetings and activities.
• Perform line-up analysis, floor planning, FET device selection, and circuit topology studies necessary to meet customer requirements.
• Perform circuit simulation, analyses, and layout as part of the design flow methodology.
• Perform circuit modeling and simulations using foundry PDK models (linear, non-linear, and EM).
• Perform 3D modeling and simulations for packaging MMIC's; work with drafters and PCB designers to develop packages and/or multi-chip modules.
• Perform simulations using Cadence/AWR AXIEM 3D planar EM and Analyst 3D FEM tools.
• Perform analyses required to achieve reliability & manufacturing compliance.
• Prepare for design reviews and preparing for manufacturing and test readiness.
• Perform RF/Microwave measurements in the lab using PNA-X and related equipment.
• Lead Engineer to assist in planning, reporting, and meeting performance, cost, and schedule objectives on programs.
• Identify & initiate improvements in the design methodology flow
• Engage and forge relationships with foundries, advanced processes & packaging suppliers in order to advance our capabilities
• Assist in business development pursuits to help shape customer requirements and system architecture trades.
• Technical lead role; prepare flow-down specifications and floor planning requirements; prepare project status to Program Management and Engineering Manager.
• Assist in IR&D roadmaps and lead IR&D projects
• Identify and contribute in continuous improvement initiatives
• Assist in technical write-ups for proposals and white papers
• Mentoring Engineers
• Support Engineering team in customer support activities and preparing technical reports
• Lead and collaborate team meetings and activities.