Bachelors degree or higher in Electrical Engineering, Mechanical Engineering, or related technical field
7+ years of experience in technical product management for high-performance handheld devices.
Experience with mobile ODM ecosystems, custom chassis tooling, and advanced thermal solutions
Knowledge of SOC architecture, memory topologies, and firmware power states (PL1/PL2)
Strong understanding of advanced cooling technologies such as vapor chambers, heat pipes, and micro-pumps
Knowledge of high-bandwidth unified memory architectures and thermal architecture integration
Experience with thermal system design, calibration, and validation
Familiarity with industry regulatory standards and quality control processes
Bilingual in English and Mandarin is a must
Responsibilities
Drive engineering development of bespoke high-capacity internal thermal systems capable of rejecting large heat loads without external docks.
Manage the integration of high-bandwidth unified memory architectures to achieve extensive context windows for AI models.
Ensure the system maintains maximum clock speeds and thermal stability during sustained high-wattage loads.
Collaborate with cross-functional teams to optimize thermal, mechanical, and firmware integration for consistent performance.
Enforce quality standards and have the authority to veto sign-offs if thermal or clock performance issues arise during development.
Keywords
mobile thermal management, high-performance computing, AI workstation, thermal architecture, vapor chambers, heat pipes, micro-pumps, high bandwidth memory, unified memory, SOC architecture, firmware power states, system integration, thermal validation, acoustic performance, thermal throttling, heat rejection, portable AI solutions, ODM ecosystems, high wattage systems, temperature control