IF1139 GE Aviation Systems LLC is seeking an Advanced Lead – SiC/GaN Power Module Packaging Engineer in Pompano Beach, FL. Your role will focus on designing power modules and optimizing the manufacturing processes crucial for efficient and high-density power electronics.With a Master's or higher in relevant fields and 3+ years in semiconductor manufacturing, you will work collaboratively with R&D teams, ensuring manufacturability and compliance with industry standards. A competitive benefits package including medical insurance, retirement plans, and tuition reimbursement is offered.#J-18808-Ljbffr