Aerospace and Defense, Cleanroom, Conformance Testing, Detail Oriented, Electronics, Engineering Drawing, Functional Testing, IPC Standards, Printed Circuit Board (PCB), Production Volume, Radiography, Solder Joint, Soldering, Surface Mount Technology
We are seeking a highly experienced Solder Assembler with deep expertise in both surface?mount technology (SMT) and through?hole soldering. The ideal candidate will be proficient in reworking and repairing a wide range of componentsincluding bottom?terminated devices such as QFNs, BGAs, and LGAsusing advanced rework equipment and X?ray inspection methods. This role supports high?mix, low?volume production of critical aerospace and defense electronics, requiring meticulous attention to detail and a strong commitment to quality.
Key Responsibilities
Perform high?mix SMT and through?hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
Remove, replace, and re?work components, including bottom?terminated devices (QFNs, BGAs, LGAs) using hot?air pencils, hot plates, reflow ovens, and specialty rework stations.
Conduct X?ray inspection of re?worked bottom?terminated parts, evaluate solder joint integrity, and document findings.
Execute board?level verification (visual, AOI, X?ray) and functional testing to ensure conformance to specifications.
Maintain cleanroom and ESD?controlled work areas; monitor and record equipment parameters (temperature, airflow, etc.).
Participate in continuous?improvement initiatives, suggest process enhancements, and assist in training junior assemblers.
Required Qualifications
Requirement Details
Experience Minimum 5?years of hands?on SMT/TH solder assembly in a high?mix, low?volume environment (aerospace, defense, or similar).
IPC?A-610, and IPC?J?STD?001 standards.
Proficient with microscopes, Project Code :T
The Structures Company, LLC