MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
MACOM is an Equal Opportunity Employer
We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status
Manager Manufacturing Operations
Location: Hsinchu, Taiwan
Description:
Job Description and Responsibilities:
As part of the Outsourced Assembly team, the candidate shall be able to:
- Manage Assembly Engineering teams and activities with a contract manufacturer to enable production revenue requirements for backend wafer process including Singulation, AOI, Wafer flip, Die sort and wafer acceptance testing.
- Manage, sustain, and improve assembly yields by defining assembly processes.
- Manage capacity against forecast.
- Manage NPI engineering activities for new products.
- Provide supplier benchmarking and tracking data to drive backend technology roadmap.
- Drive back-end process development for improved reliability, DFM, DFT, and short cycle-time with effective in-line controls and SPC
- Working with cross-functional teams to ensure timely execution for all business needs.
Job Requirements:
- BS in Materials Science, Chemical, EE or ME plus 10+ years of experience with advanced IC package assembly/test process development and design.
- Experience leading Package/Assembly/Test engineering teams in a manufacturing environment with the objective of minimizing cost while improving productivity.
- Experience in reliability, failure analysis, and quality assurance in advanced package process development, effects of mechanical, environmental, and thermal stress, debug, and qualifications
- Experience in backend wafer process, preferably with InP.
- Experience with SPC, DOE, FMEA and Failure Analysis.
- Intimate knowledge of Photodiode backend wafer process.
- Demonstrated ability to lead independent process development and provide suppliers direction by working with design and quality organizations
- Experience in the semiconductor assembly Quality and Reliability with critical thinking and presentation skills.
- Experience in supplier management and proven Program Management skills.
- Proven expertise in directing mixed volume manufacturing operations with ability to establish and maintain strategic partnerships with foundries and assembly partners.
- Desire knowledge using: AutoCad, Data visualization tools, and AI tools
- Strong problem-solving skills , teamwork, and interpersonal skills.
Excellent communication skills in English, both written and verbal
Functional Competencies
- Deciding and Initiating Action
- Makes timely, data‑driven decisions.
- Takes ownership of assigned processes and deliverables.
- Operates with appropriate independence and accountability.
Relating and Networking
- Build strong working relationships with subcontract partners and internal stakeholders.
- Communicates effectively across engineering, quality, and operations functions.
- Comfortable operating in a MACOM‑based role with supplier‑embedded responsibilities.
Analyzing
- Analyses numerical, operational, and technical data to drive conclusions.
- Apply structured problem‑solving methodologies.
- Understands interdependencies across manufacturing and supply chain flows.
Personal Characteristics
- Hands‑on, detail‑oriented engineer with a strong sense of ownership.
- Resilient and effective in production‑driven environments.
- Able to manage multiple priorities across internal and supplier organizations.
- Demonstrates disciplined problem‑solving skills with strong attention to detail.