As part of the Outsourced Assembly team, the candidate shall be able to:
Manage Assembly Engineering teams and activities with a contract manufacturer to enable production revenue requirements for backend wafer process including Singulation, AOI, Wafer flip, Die sort and wafer acceptance testing.
Manage, sustain, and improve assembly yields by defining assembly processes.
Manage capacity against forecast.
Manage NPI engineering activities for new products.
Provide supplier benchmarking and tracking data to drive backend technology roadmap.
Drive back-end process development for improved reliability, DFM, DFT, and short cycle-time with effective in-line controls and SPC
Working with cross-functional teams to ensure timely execution for all business needs.