Summary
We are seeking a Manufacturing Engineer to support the cleaving, bar stacking/unstacking and dicing operations within our semiconductor manufacturing facility. This role is responsible for maintaining production flow by troubleshooting equipment and process issues, performing routine calibration and maintenance of equipment, monitoring product quality, and driving continuous process improvements to improve yield, quality, and throughput.
Primary Responsibilities
Production Support
Troubleshoot production issues affecting cleaving, bar stacking/unstacking and dicing operations
Resolve equipment and work order issues to minimize production downtime
Support daily production activities to ensure smooth manufacturing flow
Equipment Ownership
Perform daily calibration of cleaving and dicing equipment
Monitor equipment performance and coordinate preventive maintenance
Identify equipment-related problems and implement corrective actions
Process Improvement
Perform root cause analysis on manufacturing issues
Analyze production data to identify process improvements
Improve yield, throughput, and process stability
Implement corrective and preventive actions (CAPA)
Develop process recipes for new products
Quality
Monitor daily production quality for abnormalities
Investigate defects related to cleaving and dicing processes
Collaborate with Quality Engineering to resolve manufacturing issues
Documentation & Training
Develop and maintain SOPs and work instructions
Train manufacturing technicians and operators
Maintain engineering documentation
Cross-functional Support
Collaborate with Production, Quality, Process Engineering, Production Control, and IT to improve manufacturing efficiency
Perform other duties as assigned
New Equipment Qualification
Intensively collaborate with vendor for new tool design proposal
Make FAT and SAT documents for new tools
In charge of new tool move in, installation, modification and qualification
Qualifications
Master’s degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline
Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing
Experience maintaining automated manufacturing equipment
Knowledge of semiconductor manufacturing processes
Strong troubleshooting and root cause analysis skills
Experience using Excel for data analysis
Familiarity with LabVIEW is a plus
Ability to work in a cleanroom environment
Strong ability in communication. Good at efficiently communicating with vendors on technical terms and negotiations
Ability lift or move items weighing up to 20 pounds
Location
This position will be on-site based in Sugar Land, Texas.
WHY AOI?
In addition to competitive salary, AOI offers
Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs
Employer matching on 401(k) deferrals
Generous PTO policy, with unused PTO payout at end of the year
Relocation package available within US
Immigration sponsorships (Must be currently authorized to work in the US)
We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.