Manufacturing Engineer

WHO WE ARE

At NovaSensor, an Amphenol company, we are pioneers in high accuracy sensing solutions. As a global leader in MEMS Microelectromechanical Systems technology, we design and manufacture advanced pressure sensors that power critical applications across the medical, industrial, and transportation markets-whether it is enabling life-saving medical devices, enhancing vehicle safety and efficiency, or ensuring reliability in industrial systems. We are part of Amphenol, a global leader in advanced interconnect systems serving diverse markets including automotive, aerospace, industrial, and mobile devices. Amphenol Corporation, a member of the Fortune 500 NYSE APH, was established in 1932 and has pioneered innovation in electronics for nearly a century across virtually every end market.

POSITION SUMMARY

The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors, including MEMS ICs, ASICs, discrete sensors. This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical, mechanical, thermal performance, cost, manufacturability, and reliability to support Amphenols product roadmaps.

KEY RESPONSIBILITIES

• Develop and qualify new package types and assembly processes and flows, including die attach, wire bond, flip-chip molding, plating, soldering, and encapsulation. • Define manufacturing process flows, tooling, materials, specifications, and control plans for prototypes and high-volume production. • Lead Design for Reliability (DFR) and Manufacturing (DFXM) reviews with product design, test, and manufacturing teams. • Create and execute DOE (Design of Experiments) design of experiments to optimize process windows and yield, analyze results using statistical tools (e.g., Minitab, JMP). • Author and maintain process documentation, process sheets, work instructions, SPCC, PK, APQP, packages for automotive customers. • Partner with suppliers and contract manufacturers to qualify equipment, processes, materials, epoxies, solders, plating chemistries, and subcontractor processes, perform supplier audits as needed. • Plan and oversee reliability and environmental qualification testing, thermal cycling, HAST, temperature, humidity, bias, mechanical shock, vibration, solderability, thermal shock, interpret results, and drive corrective actions. • Perform and coordinate failure analysis, SEM, X-ray, CT, C-SAM cross-sectioning, and root-cause investigations. • Transfer processes to internal and external manufacturing sites, where needed, support production ramps, and troubleshoot yield-quality issues at manufacturing locations. • Ensure compliance with industry standards and customer requirements, including JEDEC, IPC, ISO 9001, AS9100, IATF 16949, RoHS, REACH, and other regulatory needs. • Mentor junior engineers and technicians, present technical status to stakeholders and customers.

REQUIRED QUALIFICATIONS

• BS in Materials, Electrical, or Mechanical Engineering, MS preferred. • 3 years in semiconductor or sensor packaging process development. • 2 years of hands-on experience in semiconductor or sensor packaging assembly process development or failure analysis. • Demonstrated experience with die attach, wire bonding, flip-chip molding, encapsulation, soldering, singulation, and metallization plating processes. • Practical knowledge of reliability test protocols and failure-analysis techniques. • Strong statistical analysis skills and experience with DOE, comfortable using Minitab or JMP. • Experience preparing process documentation, FMEA, control plans, and PPAP, APQP packages, especially for automotive, aerospace customers. • Excellent written and verbal communication skills, strong cross-functional collaboration. • Preferred experience and skills: • Familiarity with SEM, X-ray, CT, C-SAM microsectioning and metallographic microscopy. • Knowledge of ESD, cleanroom practices, and contamination control. • Project management experience, PMP or Six Sigma certification a plus. • Prior experience working with suppliers across APAC, EMEA, and supporting process transfer globally. • Technical tools & equipment examples: • Software: Minitab, JMP, Excel, Word, PowerPoint. • Lab process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools, pick-and-place, X-ray, CT, SEM, C-SAM environmental chambers for thermal, humidity testing.

WORKING CONDITIONS & TRAVEL

• Typical R&D lab environment with occasional exposure to cleanroom and manufacturing floor. • Global travel to supplier sites, contract manufacturers, and customer locations, as needed-typically up to 10-25 days.

DIVERSITY, SAFETY & COMPLIANCE

• Follow Amphenols EHS and quality policies, contribute to a culture of safety and continuous improvement. • Support company diversity and inclusion initiatives.

WHERE YOU WILL WORK

On-site in Fremont, CA.

WHY YOU SHOULD JOIN OUR TEAM

• Competitive salary. • 401k. • Health insurance and wellness programs. • 401k with company match. • Professional onboarding and training opportunities. • Paid time off. • Health savings account. • Flexible spending account. • Life insurance. • Inclusive and collaborative work environment. Amphenol is an Equal Opportunity Employer.