BS/MS in Mechanical Engineering with at least 8 years of experience in electronics packaging or related fields.
Telecommunication equipment experience a plus
Strong Cad designer experience using Creo. if someone is familiar with Master Molding design, that would be a big plus Will consider candidates with SolidWorks as well
Experience with Sheet Metal Designs, electronic enclosures, EMI shielding, and thermal management
Experience working with Contract Manufacturers and mass production DFM/DFA.
Any experience with liquid cooling a plus
Track record of advancing complex products from concept to mass production and sustaining.
Responsibilities
Define the mechanical enclosure and internal layout for high-density rack-mount switches, balancing airflow, cable management, manufacturability, and serviceability.
Design and simulate cooling solutions, including heatsinks, cold plates, and fan trays for high-power components.
Conduct 3D tolerance stacking to ensure alignment of high-speed connectors and signal integrity.
Specify materials for structural integrity, thermal conductivity, and electromagnetic interference shielding.
Lead mechanical validation processes including shock, vibration, thermal cycling, and acoustic testing to ensure compliance.