Microelectronics Assembly Operator (Mid Level)-Lawrence, MA
Temp to Perm and open to Direct Hire for the right candidate
Salary Range:
$21 - $25 / hour
Key Responsibilities
• Perform die attach operations (epoxy and/or eutectic methods) on ceramic substrates and hybrid circuits, with support from senior staff on complex builds
• Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
• Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
• Solder fine-pitch components, leads, and interconnects under microscope
• Assist with or perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) under supervision
• Conduct in-process visual inspections per IPC/MIL specifications
• Read and interpret schematics, assembly drawings, and work instructions
• Maintain accurate documentation/travelers for traceability
• Escalate process issues to Senior Operator and support troubleshooting efforts
• Maintain a clean, ESD-safe workstation and comply with all safety protocols
Key Responsibilities
• Perform die attach operations (epoxy and/or eutectic methods) on ceramic substrates and hybrid circuits, with support from senior staff on complex builds
• Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
• Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
• Solder fine-pitch components, leads, and interconnects under microscope
• Assist with or perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) under supervision
• Conduct in-process visual inspections per IPC/MIL specifications
• Read and interpret schematics, assembly drawings, and work instructions
• Maintain accurate documentation/travelers for traceability
• Escalate process issues to Senior Operator and support troubleshooting efforts
• Maintain a clean, ESD-safe workstation and comply with all safety protocols
| Location | Lawrence, MA |
| Job Type | Full-time |
| Salary | $21–$25 Per Hour |
Required Qualifications
• 2–5 years of hands-on experience in hybrid microelectronics assembly
• Working proficiency in die attach, wire bonding, and fly wire/tack wire methods
• Exposure to soldering and lid seal processes (independent proficiency not required but preferred)
• Familiarity with MIL-STD-883, J-STD-001, or IPC-A-610 standards (or equivalent)
• Ability to work under high magnification (microscope) for extended periods
• Strong attention to detail and manual dexterity
• Willingness to learn from and take direction from senior technical staff
Preferred Qualifications
• IPC certification(s), or working toward certification
• Experience or coursework related to government/defense contract manufacturing
• Prior experience in a cleanroom or controlled environment
Physical Requirements
• Ability to sit for extended periods while working under a microscope
• Fine motor control for precision assembly work
Browse dozens of recruiter approved resume templates, layouts and formats. Choose your favorite and make it your own in minutes.
Free resume templatesImprove your existing resume or start from scratch and create a standout, ATS-friendly resume. Add job-specific content, download and apply.
Free resume builder