Microelectronics Advanced Packaging Engineer

Microelectronics Advanced Packaging Engineer
The Opportunity:

Apply engineering physics, engineering mathematics, and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Apply specific functional knowledge and working and general industry knowledge. Develop or contribute to solutions to a variety of problems of moderate scope and complexity. Work independently with some guidance and review or guide activities of junior employees.

You Have:

• 2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
• Experience in eCAD and mCAD sof tware
• Experience with packaging, PCB fabrication, clea nro om processing, or SMT assembly
• Experience developing packaging solutions that optimize Size Weight and Power ( SWaP ) and prototyping designs in a high-mix, low-volume R & D environment
• Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
• Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems
• Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
• Ability to obtain a Secret clearance
• Bachelor's degree in an Engineering field

• 5+ years of experience with advanced packaging technology innovation and prototyping
• Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
• Knowledge of trends related to current technology, including trends related to future technologies, design, or prototyping for DoD systems
• Secret clearance
• Master's degree in an Engineering field

• Remote: If this position is listed as remote, there may still be occasions when you are required to work in person at a Booz Allen or customer facility.
• Hybrid: If this position is listed as hybrid, you will be expected to work from a Booz Allen facility frequently, in alignment with leadership expectations and the needs of the role. You may also be required to work from or visit a customer facility.
• Onsite: If this position is listed as onsite, work will primarily be performed at a Booz Allen office or customer facility, where employees will collaborate directly with colleagues and customers as required by the role.