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Module Development Engineer (Adv Packaging)

INTEL

Hillsboro, OR

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JOB DETAILS
SALARY
$94,300–$133,200 Per Year
SKILLS
Analysis Skills, Business Support, Chemical Engineering, Chemistry, Communication Skills, Cross-Functional, Electrical Engineering, Emerging Technology, Experiment Design, Feasibility Analysis, Hardware Administration, Leadership, Manufacturing, Manufacturing Requirements, Manufacturing/Industrial Processes, Material Science, Materials Engineering, Mechanical Engineering, Metrology, Multitasking, Organizational Skills, Physics, Problem Solving Skills, Process Development, Process Engineering, Process Improvement, Process Manufacturing, Semiconductor Manufacturing, Semiconductors, Statistical Process Control, Team Lead/Manager, Team Player, Technical Support, Trend Analysis, United States Department of Energy (DOE), Writing Skills
LOCATION
Hillsboro, OR
POSTED
Today

Job Description


The Role and Impact

This role is responsible for driving semiconductor technology development and manufacturing enablement for both high-volume manufacturing and next-generation technologies. The successful candidate will develop process integration and equipment solutions, conduct feasibility studies, and support the development of innovative device architectures and manufacturing technologies.

Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology roadmaps that enable future product requirements. This position requires regular onsite presence to support essential business and manufacturing activities.

Key Responsibilities

  • Drive technology development and manufacturing enablement for current and future semiconductor technologies.
  • Develop process integration and equipment solutions to meet device performance, quality, and manufacturability requirements.
  • Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, metrology development, and system design.
  • Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
  • Conduct pathfinding activities to support hardware and process development for emerging device architectures.
  • Develop technology roadmaps that support future manufacturing and product requirements.
  • Identify and implement process and equipment improvements to increase production efficiency, manufacturing capability, and overall output.
  • Collaborate with equipment and material suppliers to develop and implement enabling technologies.
  • Evaluate manufacturing trends, emerging technologies, and industry developments to identify opportunities for future process innovation.
  • Partner with cross-functional teams to support technology transfer, process qualification, and manufacturing ramp activities.

Behavioral Skills

  • Strong technical problem-solving and analytical skills.
  • Ability to lead and influence cross-functional teams in a highly collaborative environment.
  • Effective verbal, written, and presentation communication skills.
  • Strong organizational skills with the ability to manage multiple priorities simultaneously.
  • Demonstrated ability to drive results in fast-paced and technically complex environments.
  • Ability to work independently while maintaining strong stakeholder alignment.
  • Adaptability and willingness to learn new technologies, processes, and methodologies.

Qualifications


Minimum Qualifications:

  • Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline
  • 1+ years of experience utilizing Statistical Process Control (SPC) and/or Design of Experiments (DOE) methodologies.

Preferred Qualifications:

  • 1+ years of experience in semiconductor technology development.
  • 1+ years of experience delivering results for complex, time-sensitive technical projects.
  • 1+ years of experience with semiconductor fabrication processes and manufacturing technologies.
  • Previous experience working in a semiconductor foundry or high-volume semiconductor manufacturing environment.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00
*Salary range dependent on a number of factors including location and experience


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About the Company

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