Join Intel as a Module Development Engineer and become a key driver in advancing cutting-edge technologies within high-volume manufacturing and future technology development. In this role, you will lead the design and development of sophisticated manufacturing processes that enable pioneering product designs and innovative device architectures. Your contributions will directly impact Intel's position as a leader in advanced semiconductor technologies and support its mission to push the boundaries of industry innovation. Collaborate with world-class teams and partners to deliver impactful solutions and shape Intel's technological roadmap.
Key Responsibilities
- Drive the development and enablement of new technology for high-volume manufacturing and future advancements, focusing on process integration and equipment solutions.
- Lead the design and development of complex manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Conduct theoretical simulations and practical engineering studies to meet desired device specifications through feasibility studies.
- Perform pathfinding activities to spearhead process and hardware development for emerging device architectures.
- Develop roadmaps for technologies that support future advancements and maintain Intel's leadership in the industry.
- Collaborate with equipment and materials suppliers to implement enabling elements of advanced technologies.
- Recommend and execute modifications to existing equipment and processes to improve production efficiency and optimize output.
- Stay informed of industry trends related to process and material manufacturing, anticipating future needs and driving innovation
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
- Bachelor's degree with 3+ years of experience OR Master's degree with 2+ years of experience OR PhD degree with no required prior experience in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or related engineering disciplines,
Experience listed above should be in the following:
Preferred Qualifications
- Familiarity with semiconductor packaging and assembly technologies.
- Demonstrated ability to troubleshoot complex process issues and apply structured problem-solving methodologies.
- Experience working with advanced process control systems and data analysis tools, such as JMP software.
- Proven track record in driving continuous improvement projects in multidisciplinary teams.
Prior Singulation Experience (Laser and Dicing process)
This role offers the opportunity to make a meaningful impact on Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the future-apply today.
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