Operator 2, Production

Location: Alhambra, CA

Position Summary: Wafer Fab Operator Level 1 (Op1) or Level 2 (Op2) is responsible for execution of wafer fabrication processes in an InP-based photonics manufacturing environment. This role supports the production of lasers, gain chips, and other III-V photonic devices by operating advanced semiconductor equipment, maintaining process control, and ensuring high-quality wafer output.

The operator position works with moderate supervision and contributes to process consistency, WIP flow, and yield protection by minimizing contamination, handling damage, and process deviations.

Responsibilities:

Wafer Processing & Equipment Operation (50%):

• Perform routine wafer fabrication steps following SOPs:
  • Wet cleaning and chemical processing (acid/base handling)
  • Photoresist coating (spin coating, soft bake)
  • Thin film deposition and dry etch (PECVD, RIE)
• Load/unload wafers into process tools and carriers
• Ensure correct recipe selection and lot processing sequence
• Follow process travelers and MES instructions precisely
• Execute process steps according to SOPs and process recipes
• Perform wafer handling with high care to prevent damage or contamination

Wafer Inspection, Process Monitoring & Quality Control (30%):

• Monitor critical process parameters (temperature, pressure, gas flow, alignment accuracy)
• Perform in-process inspections:
  • Optical microscope inspection
  • Film thickness/index/stress measurement (profilometer/ellipsometer/flexus)
• Identify abnormal conditions and deviations from process specs
• Escalate issues to Op3 or Technician as needed

Data Recording & Documentation (10%):

• Record process data, tool usage, and lot completion in logs or MES
• Document deviations or abnormalities during processing
• Ensure traceability of all processed wafers

Continuous Improvement & Engineering Support (10%):

• Assist in engineering runs, DOE experiments, and process qualifications
• Provide feedback on process issues and yield trends
• Support implementation of process improvements

Education and Experience:

• High school diploma or equivalent (required)
• Associate degree in electronics or related field (preferred)
• For Op1 , 0–1 year experience in semiconductor wafer fab or cleanroom manufacturing environment (preferred but not required)
• For Op2, 2–3 years of experience in cleanroom environment for semiconductor wafer fabrication (III-V or photonics preferred)

Minimum Qualifications

• Technical Skills
  • Basic understanding of:
    • Cleanroom practices and contamination control
    • Chemical handling and safety
    • Wafer handling techniques
  • Ability to follow detailed SOPs and process instructions
• Behavioral Competencies
  • Strong attention to detail and discipline
  • Ability to follow instructions with high accuracy
  • Good teamwork and communication skills
  • Willingness to learn semiconductor and photonics processes
• Physical & Work Environment Requirements
  • Ability to work in a cleanroom environment for extended periods
  • Standing for long durations and performing repetitive tasks
  • Handling small, fragile wafers with precision
  • Ability to wear full cleanroom gown (including mask, gloves, and suit)
• Additional Requirements
  • Willingness to work shifts (day/night if required)
  • Compliance with all safety and operational procedures

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

A reasonable estimate of the pay range for this position is $24 - $30.  There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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